• DocumentCode
    2455903
  • Title

    A polynomial time optimal diode insertion/routing algorithm for fixing antenna problem

  • Author

    Huang, Li-Da ; Tang, Xiaoping ; Xiang, Hua ; Wong, Derek ; Liu, I-Min

  • Author_Institution
    Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    470
  • Lastpage
    475
  • Abstract
    Antenna problem is a phenomenon of plasma induced gate oxide degradation. It directly affects manufacturability of VLSI circuits, especially in deep-submicron technology using high density plasma. Diode insertion is a very effective way to solve this problem Ideally diodes are inserted directly under the wires that violate antenna rules. But in today\´s high-density VLSI layouts, there is simply not enough room for "under-the-wire" diode insertion for all wires. Thus it is necessary to insert many diodes at legal "off-wire" locations and extend the antenna-rule violating wires to connect to their respective diodes. Previously only simple heuristic algorithms were available for this diode insertion and routing problem. In this paper we show that the diode insertion and routing problem for an arbitrary given number of routing layers can be optimally solved in polynomial time. Our algorithm guarantees to find a feasible diode insertion and routing solution whenever one exists. Moreover we can guarantee to find a feasible solution to minimize a cost function of the form α · L + β · N where L is the total length of extension wires and N is the total number of Was on the extension wires. Experimental results show that our algorithm is very efficient
  • Keywords
    VLSI; integrated circuit interconnections; integrated circuit layout; integrated circuit reliability; integrated circuit yield; minimisation; plasma materials processing; sputter etching; IC yield; VLSI circuit; cost function; deep-submicron technology; diode insertion; gate oxide degradation; heuristic algorithms; high-densily VLSI layouts; manufacturability; off-wire locations; plasma effects; reliability; routing solution; Circuits; Degradation; Diodes; Manufacturing; Plasma density; Plasma materials processing; Polynomials; Routing; Very large scale integration; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe Conference and Exhibition, 2002. Proceedings
  • Conference_Location
    Paris
  • ISSN
    1530-1591
  • Print_ISBN
    0-7695-1471-5
  • Type

    conf

  • DOI
    10.1109/DATE.2002.998315
  • Filename
    998315