• DocumentCode
    2456028
  • Title

    Substantiation of sequential test parameters for mass-produced electronic devices

  • Author

    Michlin, Yefim Haim ; Shaham, Ofer ; Lumelskii, Y.P.

  • Author_Institution
    Fac. of Ind., Eng. & Manage., Technion - Israel Inst. of Technol., Haifa, Israel
  • fYear
    2012
  • fDate
    14-17 Nov. 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A planning methodology is proposed for checking the acceptability of a lot of products in terms of the percentage of defectives using the Sequential Probability Ratio Test (SPRT). For a stable, high-volume production process, in which the statistics is known (from the percentage of defectives in an accepted lot and from rejection of a whole the lot, cost per observation, the apriori probability distribution of the percentage of defectives) the sought test is to be planned, such that the expected loss due to wrong decisions and to the cost of the observations - is minimal (maximum profit). The originality of the proposed approach lies in the fact that the permissible percentage of defectives (e.g. in the form of the commonly used Acceptable Quality Level (AQL) and Limiting Quality Level (LQL)) is not specified. The only relevant information is the statistic data as mentioned above.
  • Keywords
    electrical products industry; flow production systems; mass production; production planning; statistical distributions; SPRT; mass produced electronic device; planning methodology; probability distribution; product acceptability checking; production process; sequential probability ratio test; sequential test parameter; statistics; Economics; Optimized production technology; Planning; Probability; Reliability; Testing; Binomial test; Sequential Probability Ratio Test; lot acceptance; mass-production;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical & Electronics Engineers in Israel (IEEEI), 2012 IEEE 27th Convention of
  • Conference_Location
    Eilat
  • Print_ISBN
    978-1-4673-4682-5
  • Type

    conf

  • DOI
    10.1109/EEEI.2012.6376986
  • Filename
    6376986