DocumentCode
2457082
Title
Flip Chip Assembly of Surface Acoustic Wave Devices
Author
MacDonald, B.M. ; Rogerson, S.P. ; Walmsley, P.D.
fYear
1984
fDate
14-16 Nov. 1984
Firstpage
36
Lastpage
39
Keywords
Acoustic transducers; Acoustic waves; Assembly; Bonding; Flip chip; Gold; Packaging; SAW filters; Surface acoustic wave devices; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE 1984 Ultrasonics Symposium
Conference_Location
Dallas, Texas, USA
Type
conf
DOI
10.1109/ULTSYM.1984.198259
Filename
1535199
Link To Document