DocumentCode :
2457082
Title :
Flip Chip Assembly of Surface Acoustic Wave Devices
Author :
MacDonald, B.M. ; Rogerson, S.P. ; Walmsley, P.D.
fYear :
1984
fDate :
14-16 Nov. 1984
Firstpage :
36
Lastpage :
39
Keywords :
Acoustic transducers; Acoustic waves; Assembly; Bonding; Flip chip; Gold; Packaging; SAW filters; Surface acoustic wave devices; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEEE 1984 Ultrasonics Symposium
Conference_Location :
Dallas, Texas, USA
Type :
conf
DOI :
10.1109/ULTSYM.1984.198259
Filename :
1535199
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2457082
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