CAD for HMICs/MMICs including multilayer structures and MCM technology

Author

Jansen, R.H. ; Meyer, A. ; Boysen, Ph.A.

Author_Institution

RWTH, Tech. Hochschule Aachen, Germany

Volume

4

fYear

1998

fDate

20-22 May 1998

Firstpage

169

Abstract

The use of three and more conductor levels in RF, microwave and mm-wave hybrid (HMICs) and monolithic (MMICs) integrated circuits (ICs) and associated recent CAD development work is discussed. Multilayer IC configurations do not only allow compact wiring and interconnection in high speed digital ICs and in Multi-Chip Module (MCM) technology, but also provide new design options for vertically integrated, geometrically compact passive components with hitherto unachieved functionality and electrical performance. Following several years of experience with multilayer design and verification, respective layout-oriented CAD interfaces and algorithms are now reaching a first level of maturity

Keywords

MIMIC; MMIC; UHF integrated circuits; circuit CAD; digital integrated circuits; high-speed integrated circuits; hybrid integrated circuits; integrated circuit design; microwave integrated circuits; millimetre wave integrated circuits; multichip modules; CAD development work; MCM technology; MIMIC; MM-wave hybrid ICs; MMIC; RF ICs; RFIC; UHF ICs; geometrically compact passive components; high speed digital ICs; microwave hybrid ICs; monolithic integrated circuits; multi-chip modules; multilayer structures; vertically integrated components; Conductors; Design automation; High speed integrated circuits; Hybrid integrated circuits; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Nonhomogeneous media; Radio frequency; Radiofrequency integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves and Radar, 1998. MIKON '98., 12th International Conference on

Conference_Location

Krakow

Print_ISBN

83-906662-0-0

Type

conf

DOI

10.1109/MIKON.1998.738469

Filename

738469