Title :
A new on-wafer de-embedding technique for on-chip rf transmission line interconnect characterization
Author :
Tretiakov, Yuri ; Woods, Walt ; Venkatadri, Swathi ; Zwick, T.
Keywords :
Admittance measurement; Impedance; Integrated circuit interconnections; Integrated circuit measurements; Integrated circuit modeling; Radio frequency; Scattering parameters; Testing; Transmission line measurements; Transmission lines;
Conference_Titel :
ARFTG Conference Digest Spring, 2004. 63rd
Print_ISBN :
0-7803-8371-0
DOI :
10.1109/ARFTG.2004.1387857