Title :
SVD-Based 3D Image Quality Assessment by Using Depth Information
Author :
Lan Zhang ; Xingang Liu ; Kaixuan Lu
Author_Institution :
Sch. of Electron. Eng., Univ. of Electron. & Sci. Technol. of China, Chengdu, China
Abstract :
Currently, as demonstrated in numerous researches and studies of evaluating the three-dimension (3D) image quality, two-dimension (2D) image quality assessment methods cannot be directly applied to measure the quality of 3D image. With the increasing demands of end-users to the visual perception in 3D image, it is necessary and urgent to propose efficient 3D image quality assessment methods. In this paper, a novel 3D image quality assessment method is proposed. In the proposed method, the image pixel blocks are firstly separated into different planes according to their depth values on the basis of the perception of human visual system (HVS). The singular value decomposition (SVD) mechanism is applied into different planes respectively. Then, the final results are calculated in terms of the global error, which is the distance of the distorted image deviated from the original image. To evaluate the performance of the proposed method, the popular LIVE 3D image quality database is utilized in our experiments. As shown in our experimental results, the proposed method has a better performance compared with other methods.
Keywords :
computer graphics; image processing; singular value decomposition; 2D image quality assessment methods; 3D image quality assessment methods; 3D image visual perception; SVD mechanism; SVD-based 3D image quality assessment; depth information; human visual system; image pixel blocks; singular value decomposition; Distortion measurement; Image quality; PSNR; Quality assessment; Singular value decomposition; Three-dimensional displays; Transform coding; depth plane; singular value decomposition (SVD); three-dimension (3D) image quality assessment;
Conference_Titel :
Computational Science and Engineering (CSE), 2014 IEEE 17th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4799-7980-6
DOI :
10.1109/CSE.2014.323