A new surface integral formulation for wideband impedance extraction of 3-D structures

Detailed electromagnetic analysis of three-dimensional structures in multi-layered dielectric media is critical for automatic generation of equivalent circuit models for the interconnects and packages in RF or mixed signal integrated circuits. In this paper we present a new wideband surface integral formulation that can be readily combined with the well-established layered Green´s function techniques. In discretizing the formulation, we have used the well-known RWG linear basis function to reduce the number of unknowns. Using a so-called loop-star basis transformation and the frequency normalization, the accuracy at low frequencies has been improved substantially. Several numerical examples are used to validate the accuracy and robustness of this new formulation.