• DocumentCode
    2460780
  • Title

    The "Inside Tech USA" Summer Course: A leadership Program that Offers New Qualifications for Engineers

  • Author

    Giannetti, Romano ; Pecharroman, Ramon R. ; Heller, Christine ; Herrero, Jose

  • Author_Institution
    Escuela Tec. Super. de Ing. (ICAI), Univ. Pontificia Comillas de Madrid, Madrid
  • fYear
    2007
  • fDate
    9-11 Nov. 2007
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Over the next decade, Spain (as in most Western countries) will face an acute shortage of newly qualified engineers. In addition, the professional career of these engineers will evolve in an international and multicultural environment that requires additional skills that are not part of the traditional curricula imparted in technical education. The Comillas University of Madrid is seriously concerned about this problem and is consequentlyacting in several different ways. The most important actions are the very well-known Erasmus program and the changes needed to adapt to the new European Higher Education Area (EHEA). This paper is devoted to a different and very innovative one: the ´Inside Tech USA´ Summer Course. ´Inside Tech USA´ is the fourth edition of a theory-based and practical summer course taking place in July in Boston and Washington D.C. The course is organized by the Spanish Comillas University´s School of Engineering (ICAI) in conjunction with the Georgetown University CIED (Center for Intercultural Education and Development) in the United States.
  • Keywords
    educational courses; electronic engineering education; Erasmus program; European higher education area; Inside Tech USA summer course; leadership program; Companies; Educational programs; Engineering profession; Government; Investments; NASA; Power engineering and energy; Qualifications; Space technology; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Meeting the Growing Demand for Engineers and Their Educators 2010-2020 International Summit, 2007 IEEE
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4244-1915-9
  • Electronic_ISBN
    978-1-4244-1916-6
  • Type

    conf

  • DOI
    10.1109/MGDETE.2007.4760383
  • Filename
    4760383