Title :
Modeling and Simulation of Lunar Lander Soft-Landing Using Transient Dynamics Approach
Author :
Wan, Junlin ; Nie, Hong ; Chen, Jinbao ; Lin, Qing
Author_Institution :
Key Lab. of Fundamental Sci. for Nat. Defense-Adv. Design Technol. of Flight Vehicle, Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
Abstract :
Landing dynamics analysis is necessary for the success of the lunar lander soft-landing. Recent advances in computational speed have made lunar lander soft-landing modeling and simulation using a nonlinear, transient dynamics, finite element analysis code more feasible. A new approach to study the soft-landing of lunar lander has been described in this paper. The simulation of lunar lander soft-landing selected MSC.DYTRAN. By taking a certain type of lunar lander as the research object, the flexible models of the lander structure and the lunar regolith are established. The lander has four landing legs, and has corresponding shock absorbers using Al-honeycomb. Two specific nonlinear characteristics of the honeycomb and the lunar regolith of simulation model are preset, and the nonlinear frictions are considered. The results are then compared to and validated by test data. Simulation results are presented to investigate the performance of energy absorbing system in soft-landing. The time history of internal energy of the lander structure and the lunar regolith during the entire soft-landing event are obtained.
Keywords :
aerospace simulation; aircraft landing guidance; finite element analysis; lunar interior; lunar surface; space vehicles; Al-honeycomb; MSC.DYTRAN; energy absorbing system; finite element analysis; lander structure; landing dynamics analysis; lunar lander soft-landing; lunar regolith; nonlinear frictions; transient dynamics approach; Analytical models; Dynamics; Finite element methods; Leg; Mathematical model; Moon; Vehicle dynamics; computer software; lunar lander; simulation; soft-landing; transient dynamics;
Conference_Titel :
Computational and Information Sciences (ICCIS), 2010 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-8814-8
Electronic_ISBN :
978-0-7695-4270-6
DOI :
10.1109/ICCIS.2010.184