• DocumentCode
    2462190
  • Title

    Surface migration as a possible cause for late breakdowns [in vacuum interrupters]

  • Author

    Jüttner, Burkhard

  • Author_Institution
    Inst. of Phys., Humboldt-Univ., Berlin, Germany
  • Volume
    2
  • fYear
    1998
  • fDate
    17-21 Aug 1998
  • Firstpage
    488
  • Abstract
    With a certain probability, in vacuum interrupters the recovery voltage leads to breakdown with a delay of many milliseconds or even seconds to current zero when the plasma or metal vapour has already completely disappeared. A conventional explanation of these late breakdowns are microparticles released by mechanical shocks from the electrodes or inner walls. The present paper reports on a model experiment. Metal vapour plasma is injected from a vacuum arc into a neighbouring high voltage gap where field electron emission is used as an indicator for the voltage strength. It has been found that this plasma enhances the field emission, thus reducing the voltage strength. The effect takes place some milliseconds up to several seconds after the plasma injection, and the time constants of the increase of the emission amount to 1-1000 ms. Mechanical shocks have similar effects and time constants. From this behaviour, it is concluded that surface migration with long time constants can influence the voltage strength of arced surfaces
  • Keywords
    circuit-breaking arcs; electrodes; electron field emission; plasma; switchgear testing; vacuum arcs; vacuum breakdown; vacuum interrupters; 1 to 1000 ms; arced surfaces; breakdown delay; field electron emission; mechanical shocks; metal vapour plasma injection; microparticles; recovery voltage; surface migration; time constants; vacuum interrupters; voltage strength; Breakdown voltage; Delay; Electric breakdown; Electric shock; Electrodes; Electron emission; Interrupters; Plasmas; Vacuum arcs; Vacuum breakdown;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 1998. Proceedings ISDEIV. XVIIIth International Symposium on
  • Conference_Location
    Eindhoven
  • ISSN
    1093-2941
  • Print_ISBN
    0-7803-3953-3
  • Type

    conf

  • DOI
    10.1109/DEIV.1998.738697
  • Filename
    738697