Title :
Simulation of an Ultrasonic Bonding Tool
Author :
Li, X. ; Bilgutay, N.M. ; McBrearty, M. ; Prybella, J.R.
Keywords :
Analytical models; Bonding processes; Computational modeling; Impedance; Integrated circuit modeling; Phase locked loops; Resonant frequency; Vibrations; Voltage; Wire;
Conference_Titel :
IEEE 1985 Ultrasonics Symposium
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/ULTSYM.1985.198573
