DocumentCode
2463087
Title
Simulation of an Ultrasonic Bonding Tool
Author
Li, X. ; Bilgutay, N.M. ; McBrearty, M. ; Prybella, J.R.
fYear
1985
fDate
16-18 Oct. 1985
Firstpage
567
Lastpage
571
Keywords
Analytical models; Bonding processes; Computational modeling; Impedance; Integrated circuit modeling; Phase locked loops; Resonant frequency; Vibrations; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE 1985 Ultrasonics Symposium
Conference_Location
San Francisco, CA, USA
Type
conf
DOI
10.1109/ULTSYM.1985.198573
Filename
1535513
Link To Document