DocumentCode
2464479
Title
Resource scheduling based on dynamic dependence injection in virtualization-based simulation grid
Author
Liu, Hanbing ; Su, Hongyi ; Zhan, Shouyi ; Chai, Xundong ; Zhang, Yabin ; Hou, Baocun ; Guo, Linqin ; Fan, Shuai
Author_Institution
School of Computer Science and Technology Beijing Institute of Technology, Beijing, China
fYear
2010
fDate
14-16 April 2010
Firstpage
396
Lastpage
401
Abstract
With the grid applied in simulation widely, the traditional grid scheduling can not meet the requirements, which needs to server the appointed domain application not the simple computation jobs. The exiting grid scheduling mechanisms based on the physical computing nodes, which deployed with appointed environment, make the simulation resource usage less flexible and efficient due to the system structure limitation. According to the simulation application requirement, this paper integrated virtualization technology into the exited Simulation Grid to break the static dependence coupling and proposed a dynamic dependence injection scheduling mechanism. Furthermore, some solved key techniques are introduced, mainly including resource discovery and selection algorithm based the simulation resource virtualization encapsulation. This scheduling mechanism has a better efficiency in dynamic deployment, the real-time operation and the capabilities of current networked M&S platform on highly customizable resources sharing, collaboration and fault tolerant. Finally, the conclusion and some further works are given.
Keywords
Application virtualization; Collaborative work; Computational modeling; Dynamic scheduling; Encapsulation; Fault tolerance; Grid computing; Physics computing; Processor scheduling; Resource virtualization; Dynamic Dependence Injection; Scheduling; Service-Oriented; Simulation Resource Management; Virtualization-based Simulation Grid;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Supported Cooperative Work in Design (CSCWD), 2010 14th International Conference on
Conference_Location
Shanghai, China
Print_ISBN
978-1-4244-6763-1
Type
conf
DOI
10.1109/CSCWD.2010.5471942
Filename
5471942
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