• DocumentCode
    2464822
  • Title

    Thermal and spatial design of a high power density drive

  • Author

    Gerber, Mark ; Popovic-Gerber, Jelena ; Ferreira, Braham

  • Author_Institution
    Electr. Power Process., Delft Univ. of Technol., Delft
  • fYear
    2008
  • fDate
    15-19 June 2008
  • Firstpage
    2955
  • Lastpage
    2961
  • Abstract
    Industrial drives, like many other power electronics applications are experiencing an ever increasing demand for high power densities. Only through a system integration approach which involves an integrated thermal and spatial design and using integration technologies can this goal be achieved. Hybrid integration in the form of integrated power electronics modules (IPEMs) is one of the key elements of this approach. Advanced thermal management with optimised air flow and a special heat sink structure is the other key element. In this paper a thermal management concept for high power density drives is investigated and a novel method, i.e. the integrated I-Housing, is utilized to implement the heat removal system. The complex thermal management structure consisting of an impingement cooled pin fin heatsink and heat exhaust paths, which significantly reduce the amount of air required for cooling, are modelled. The model presented in this paper is experimentally verified with a thermal dummy. The model is ultimately to be used to design the thermal management for a fully functional 2.2 kW inverter with a total volume of 500 cm3 - four times smaller than the current state of the art.
  • Keywords
    electric drives; heat sinks; power electronics; thermal management (packaging); heat removal system; heat sink; high power density drive; hybrid integration; industrial drives; integrated power electronics modules; power 2.2 kW; power inverter; spatial design; system integration; thermal design; thermal management; Cooling; Electronics industry; Energy management; Heat sinks; Inverters; Power electronics; Power system management; Power system modeling; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 2008. PESC 2008. IEEE
  • Conference_Location
    Rhodes
  • ISSN
    0275-9306
  • Print_ISBN
    978-1-4244-1667-7
  • Electronic_ISBN
    0275-9306
  • Type

    conf

  • DOI
    10.1109/PESC.2008.4592400
  • Filename
    4592400