DocumentCode
2466041
Title
Optimum Design for Microstructures of Closed-Cell Materials Based on Thermal Conductivity
Author
Zhao Junfeng ; Cui Junzhi ; Li Wei
Author_Institution
Dept. of Appl. Math., Northwestern Polytech. Univ., Xi´an, China
fYear
2010
fDate
17-19 Dec. 2010
Firstpage
1029
Lastpage
1032
Abstract
Taking our proposition about the grid-based simulation for the microstructure of the closed-cell foam into account, and choosing position of voids as optimal variables, this paper builds an optimal model for the two-phase material with maximizing the effective thermal conductivity of the microstructure. Then the paper seeks its solution by using the genetic algorithm. The numerical results show that the optimal model we built is reasonable and the optimal algorithm we used to solve this model is also effective. Furthermore, the results illustrate how the related factors make an effect on the optimal solution.
Keywords
composite materials; crystal microstructure; design engineering; foams; genetic algorithms; mechanical engineering computing; thermal conductivity; voids (solid); closed-cell foam; closed-cell material; composite material; genetic algorithm; grid-based simulation; microstructure; optimum design; thermal conductivity; two-phase material; void; Composite materials; Conductivity; Microstructure; Optimization; Thermal conductivity; Topology; closed-cell materials; genetic algorithm; microstructure;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational and Information Sciences (ICCIS), 2010 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-8814-8
Electronic_ISBN
978-0-7695-4270-6
Type
conf
DOI
10.1109/ICCIS.2010.254
Filename
5709435
Link To Document