• DocumentCode
    2466041
  • Title

    Optimum Design for Microstructures of Closed-Cell Materials Based on Thermal Conductivity

  • Author

    Zhao Junfeng ; Cui Junzhi ; Li Wei

  • Author_Institution
    Dept. of Appl. Math., Northwestern Polytech. Univ., Xi´an, China
  • fYear
    2010
  • fDate
    17-19 Dec. 2010
  • Firstpage
    1029
  • Lastpage
    1032
  • Abstract
    Taking our proposition about the grid-based simulation for the microstructure of the closed-cell foam into account, and choosing position of voids as optimal variables, this paper builds an optimal model for the two-phase material with maximizing the effective thermal conductivity of the microstructure. Then the paper seeks its solution by using the genetic algorithm. The numerical results show that the optimal model we built is reasonable and the optimal algorithm we used to solve this model is also effective. Furthermore, the results illustrate how the related factors make an effect on the optimal solution.
  • Keywords
    composite materials; crystal microstructure; design engineering; foams; genetic algorithms; mechanical engineering computing; thermal conductivity; voids (solid); closed-cell foam; closed-cell material; composite material; genetic algorithm; grid-based simulation; microstructure; optimum design; thermal conductivity; two-phase material; void; Composite materials; Conductivity; Microstructure; Optimization; Thermal conductivity; Topology; closed-cell materials; genetic algorithm; microstructure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational and Information Sciences (ICCIS), 2010 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-8814-8
  • Electronic_ISBN
    978-0-7695-4270-6
  • Type

    conf

  • DOI
    10.1109/ICCIS.2010.254
  • Filename
    5709435