• DocumentCode
    2466943
  • Title

    ESD device simulation in a pre-Si phase

  • Author

    Li, Zhiguo ; Yue, Suge

  • Author_Institution
    Beijing Microelectron. Technol. Inst., Beijing
  • fYear
    2008
  • fDate
    8-10 Dec. 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this paper, a novel approach that performs device simulation in the pre-Si phase to evaluate the robustness of the ESD protection device is presented. Several key parameters, such as the spacing from gate to source contact, the spacing from gate to drain contact, the length of the gate and the width of the gate are researched using the simulator MEDICI. Tunneling phenomenon is also observed and expatiated in ESD protection device. An empirical equation is derived based on the simulation to calculate the failure threshold of the device. The prediction of ESD protection circuit performance in early design phase shortens the design cycle and reduces the cost.
  • Keywords
    CMOS integrated circuits; electric breakdown; electrical contacts; electrostatic discharge; protection; tunnelling; CMOS technology; ESD device simulation; ESD protection device; NMOS; failure threshold; gate length; gate width; gate-drain contact spacing; gate-source contact spacing; tunneling phenomenon; Circuit optimization; Circuit simulation; Costs; Electrostatic discharge; Equations; Medical simulation; Performance evaluation; Protection; Robustness; Tunneling; Breakdown; ESD; MEDICI; Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2008. EDSSC 2008. IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-2539-6
  • Electronic_ISBN
    978-1-4244-2540-2
  • Type

    conf

  • DOI
    10.1109/EDSSC.2008.4760700
  • Filename
    4760700