DocumentCode
2466943
Title
ESD device simulation in a pre-Si phase
Author
Li, Zhiguo ; Yue, Suge
Author_Institution
Beijing Microelectron. Technol. Inst., Beijing
fYear
2008
fDate
8-10 Dec. 2008
Firstpage
1
Lastpage
5
Abstract
In this paper, a novel approach that performs device simulation in the pre-Si phase to evaluate the robustness of the ESD protection device is presented. Several key parameters, such as the spacing from gate to source contact, the spacing from gate to drain contact, the length of the gate and the width of the gate are researched using the simulator MEDICI. Tunneling phenomenon is also observed and expatiated in ESD protection device. An empirical equation is derived based on the simulation to calculate the failure threshold of the device. The prediction of ESD protection circuit performance in early design phase shortens the design cycle and reduces the cost.
Keywords
CMOS integrated circuits; electric breakdown; electrical contacts; electrostatic discharge; protection; tunnelling; CMOS technology; ESD device simulation; ESD protection device; NMOS; failure threshold; gate length; gate width; gate-drain contact spacing; gate-source contact spacing; tunneling phenomenon; Circuit optimization; Circuit simulation; Costs; Electrostatic discharge; Equations; Medical simulation; Performance evaluation; Protection; Robustness; Tunneling; Breakdown; ESD; MEDICI; Simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2008. EDSSC 2008. IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-2539-6
Electronic_ISBN
978-1-4244-2540-2
Type
conf
DOI
10.1109/EDSSC.2008.4760700
Filename
4760700
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