• DocumentCode
    2467234
  • Title

    An analytic surface potential based non-charge-sheet poly-Si TFT model including substrate and film thickness effects

  • Author

    Hu, Jinhua ; Zhang, Jian ; Zhang, Lining ; Liu, Feng ; He, Jin

  • Author_Institution
    Shenzhen Grad. Sch., Peking Univ., Shenzhen
  • fYear
    2008
  • fDate
    8-10 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    An analytic surface potential based non-charge-sheet model for poly-silicon thin film transistors (poly-Si TFTs) is proposed in this paper with consideration of the substrate and film thickness effects. The 1-D Poissonpsilas equation with dopant, mobile, and the trap charge terms is first solved to obtain accurate yet continuous channel potentials physically. An analytic non-charge-sheet drain current model is then derived from Pao-Sahpsilas dual integral as a function of the channel potentials at the source end and drain end. The extensive comparison between the presented model prediction and the 2-D numerical simulation is done, proving accuracy of the developed model. The presented channel potential relation and the physics based TFT drain current model may be useful for device scientists and circuit engineers to further understand TFT device physics and test TFT circuit performance.
  • Keywords
    Poisson equation; elemental semiconductors; silicon; surface potential; thin film transistors; -charge-sheet poly-Si TFT model; 1-D Poissonpsilas equation; 2-D numerical simulation; Pao-Sahpsilas dual integral; Si; analytic non-charge-sheet drain current model; analytic surface potential; film thickness effects; Circuit testing; Helium; MOSFET circuits; Numerical simulation; Physics; Poisson equations; Predictive models; Semiconductor process modeling; Substrates; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2008. EDSSC 2008. IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-2539-6
  • Electronic_ISBN
    978-1-4244-2540-2
  • Type

    conf

  • DOI
    10.1109/EDSSC.2008.4760715
  • Filename
    4760715