Coining manufacturing process for high power TWTs and TWTAs

Author

Pyles, Robert ; Kim, Roy S.

Author_Institution

DynamicWave Telecom Inc., Anaheim, CA, USA

fYear

2002

fDate

2002

Firstpage

229

Abstract

Summary form only given. Today´s industry requires higher power and frequency to meet increasing demands. Heat shrink and cold shrink are the best current manufacturing methods to assemble circuit assembly to barrel assembly to ensure quality. However, the coining process has interesting potential for manufacturing high power TWTs because the process greatly reduces production time and increases yield. Power fade is no longer a problem. TWTs have been successfully developed using the coining process at 10 W, 26.5∼40 GHz. Current development is at 30 W, 30 GHz±100 MHz with no power fade as a result of more efficient heat transfer from the traveling wave tube (TWT) to the base plate. The goal is to develop a TWT at 50 W, 26.5∼40 GHz.

Keywords

electron tube manufacture; travelling wave amplifiers; travelling wave tubes; 10 W; 26.5 to 40 GHz; 30 GHz; 30 W; 50 W; barrel assembly; circuit assembly; coining process; cold shrink; heat shrink; high power TWT; high power TWTA; manufacturing process; traveling wave tube; Assembly; Circuits; Communication industry; Frequency; Heat transfer; Manufacturing industries; Manufacturing processes; Production; Telecommunications; USA Councils;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Electronics Conference, 2002. IVEC 2002. Third IEEE International

Print_ISBN

0-7803-7256-5

Type

conf

DOI

10.1109/IVELEC.2002.999352

Filename

999352