Title :
Drop simulation of molded cushion for Largr-size LCD
Author :
Li, Wenbiao ; Wu, Xiaoming
Author_Institution :
Department of Mechaical and Electrical Engineering, Xiamen University, China
Abstract :
A drop simulation about the Large-size LCD molded cushion was implemented with the standard of drop height and fragility using ANSYS/LS-DYNA. The peak ground acceleration and the stress was achieved from the analysis. The molded pulp cushion was optimized and a reasonable project was designed using the data.
Keywords :
Analytical models; Design automation; Finite element methods; Packaging; Paper pulp; Solid modeling; TV; cushion packaging; drop impact; finite element simulation;
Conference_Titel :
Remote Sensing, Environment and Transportation Engineering (RSETE), 2011 International Conference on
Conference_Location :
Nanjing, China
Print_ISBN :
978-1-4244-9172-8
DOI :
10.1109/RSETE.2011.5965693
