DocumentCode
2469019
Title
An investigation into fan reliability
Author
Jin, Xiaohang ; Ma, Eden W M ; Chow, Tommy W S ; Pecht, Michael
Author_Institution
Centre for Prognostics & Syst. Health Manage., City Univ. of Hong Kong, Hong Kong, China
fYear
2012
fDate
23-25 May 2012
Firstpage
1
Lastpage
7
Abstract
Common failures in the electronic products can be traced back to thermal-related issues. While the power of electronic components and power densities are rapidly increasing, thermal management of electronic products becomes a challenge. Since the lifespan of electronic components is shortened drastically due to the high temperature, fans are widely used to create airflow in electronic products for cooling purpose. Therefore, fan is a critical part for thermal management in electronic products, and reliability of electronic products is heavily dependent on the fan´s reliability. There is a standard IPC-9591 that standardized fan´s performance parameters (including reliability). However, it is still difficult to compare the fan reliability directly among different fan manufacturers because they report their fans´ reliability using different parameter values in Weibull distribution, acceleration factors, and reliability tests. This paper reviews, compares, and discusses the approach of fan life expectancy calculation. It concludes that IPC-9591 recommends the most conservative values (biggest Weibull shape parameter, lowest test temperature, smallest acceleration factor) for reliability analysis. Since bearing is the most critical component in fan, its life is also discussed in the paper. Considering the very light bearing loads in fan, it is recommended that bearing life should refer to its grease life, not the fatigue life.
Keywords
cooling; electronic products; electronics industry; fans; machine bearings; reliability; standards; temperature; IPC-9591 standard; Weibull shape parameter; acceleration factor; bearing; bearing load; cooling purpose; electronic component lifespan; electronic products; fan reliability; fatigue life; grease life; power density; reliability analysis; test temperature; thermal management; thermal-related issue; Weibull distribution; accelerated life testing; fan reliability; life expectancy;
fLanguage
English
Publisher
ieee
Conference_Titel
Prognostics and System Health Management (PHM), 2012 IEEE Conference on
Conference_Location
Beijing
ISSN
2166-563X
Print_ISBN
978-1-4577-1909-7
Electronic_ISBN
2166-563X
Type
conf
DOI
10.1109/PHM.2012.6228836
Filename
6228836
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