• DocumentCode
    2469019
  • Title

    An investigation into fan reliability

  • Author

    Jin, Xiaohang ; Ma, Eden W M ; Chow, Tommy W S ; Pecht, Michael

  • Author_Institution
    Centre for Prognostics & Syst. Health Manage., City Univ. of Hong Kong, Hong Kong, China
  • fYear
    2012
  • fDate
    23-25 May 2012
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Common failures in the electronic products can be traced back to thermal-related issues. While the power of electronic components and power densities are rapidly increasing, thermal management of electronic products becomes a challenge. Since the lifespan of electronic components is shortened drastically due to the high temperature, fans are widely used to create airflow in electronic products for cooling purpose. Therefore, fan is a critical part for thermal management in electronic products, and reliability of electronic products is heavily dependent on the fan´s reliability. There is a standard IPC-9591 that standardized fan´s performance parameters (including reliability). However, it is still difficult to compare the fan reliability directly among different fan manufacturers because they report their fans´ reliability using different parameter values in Weibull distribution, acceleration factors, and reliability tests. This paper reviews, compares, and discusses the approach of fan life expectancy calculation. It concludes that IPC-9591 recommends the most conservative values (biggest Weibull shape parameter, lowest test temperature, smallest acceleration factor) for reliability analysis. Since bearing is the most critical component in fan, its life is also discussed in the paper. Considering the very light bearing loads in fan, it is recommended that bearing life should refer to its grease life, not the fatigue life.
  • Keywords
    cooling; electronic products; electronics industry; fans; machine bearings; reliability; standards; temperature; IPC-9591 standard; Weibull shape parameter; acceleration factor; bearing; bearing load; cooling purpose; electronic component lifespan; electronic products; fan reliability; fatigue life; grease life; power density; reliability analysis; test temperature; thermal management; thermal-related issue; Weibull distribution; accelerated life testing; fan reliability; life expectancy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Prognostics and System Health Management (PHM), 2012 IEEE Conference on
  • Conference_Location
    Beijing
  • ISSN
    2166-563X
  • Print_ISBN
    978-1-4577-1909-7
  • Electronic_ISBN
    2166-563X
  • Type

    conf

  • DOI
    10.1109/PHM.2012.6228836
  • Filename
    6228836