Title :
3C-1 Review of Wave Propagation in BAW Thin Film Devices - Progress and Prospects
Author_Institution :
Infineon Technol. AG, Munich
Abstract :
During the last few years the bulk acoustic wave (BAW) filters have emerged as a viable alternative to surface acoustic wave (SAW) devices. They offer superior performance regarding filtering characteristics, power handling, ESD robustness and size. The first enabling ingredient has been the rapid development in deposition techniques for the thin film piezoelectric layer. Today multiple equipment manufacturers are offering systems for depositing high quality layers with excellent piezoelectric properties. Along with the development in manufacturing issues there has also been important development in understanding the basic device physics of BAW resonators. Like any reactance elements for constructing filters there are three major concerns when designing BAW resonators: sufficient effective coupling coefficient, high Q-values and operation free of spurious modes. These properties enable the fabrication of filters with sufficient band width, low insertion loss, steep transition bands and ripple free characteristics. In this paper developments leading to state-of-the-art BAW resonators are reviewed.
Keywords :
acoustic resonator filters; acoustic wave propagation; aeroacoustics; bulk acoustic wave devices; coating techniques; piezoelectric thin films; piezoelectricity; reviews; thin film devices; BAW resonators; BAW thin film devices; ESD robustness; bulk acoustic wave filters; effective coupling coefficient; filtering characteristics; filters fabrication; high Q-values; insertion loss; piezoelectric properties; power handling; reactance elements; review; ripple free characteristics; spurious modes; steep transition bands; thin film piezoelectric layer deposition techniques; wave propagation; Acoustic propagation; Acoustic waves; Electrostatic discharge; Filtering; Manufacturing; Power filters; Resonator filters; Surface acoustic wave devices; Surface acoustic waves; Thin film devices;
Conference_Titel :
Ultrasonics Symposium, 2007. IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4244-1384-3
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2007.43