DocumentCode :
2470396
Title :
Gate sizing: finFETs vs 32nm bulk MOSFETs
Author :
Swahn, Brian ; Hassoun, Soha
Author_Institution :
Tufts Univ., Medford, MA
fYear :
0
fDate :
0-0 0
Firstpage :
528
Lastpage :
531
Abstract :
FinFET devices promise to replace traditional MOSFETs because of superior ability in controlling leakage and minimizing short channel effects while delivering a strong drive current. We investigate in this paper the gate sizing of finFET devices, and we provide a comparison with 32nm bulk CMOS. Wider finFET devices are built utilizing multiple parallel fins between the source and drain. Independent gating of the finFET´s double gates allows significant reduction in leakage current. We perform temperature-aware circuit optimization by modeling delay using temperature-dependent parameters, and by imposing constraints that limit the maximum allowable number of parallel fins. We show that finFET circuits are superior in performance and produce less static power when compared to 32nm circuits
Keywords :
MOS integrated circuits; MOSFET; circuit optimisation; delays; integrated circuit modelling; 32 nm; bulk CMOS; bulk MOSFET; finFET circuits; finFET devices; gate sizing; leakage current; parallel fins; temperature-aware circuit optimization; temperature-dependent parameters; Circuits; Constraint optimization; Delay; FinFETs; Leakage current; MOSFETs; Power dissipation; Semiconductor device modeling; Threshold voltage; Voltage control; Design; FinFET; gate sizing; thermal modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location :
San Francisco, CA
ISSN :
0738-100X
Print_ISBN :
1-59593-381-6
Type :
conf
DOI :
10.1109/DAC.2006.229286
Filename :
1688854
Link To Document :
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