• DocumentCode
    2470664
  • Title

    Simulation assisted FMEA of electronic product

  • Author

    Zhang, Xiaoqin ; Chen, Ying ; Ma, Xiang ; Kang, Rui

  • Author_Institution
    Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
  • fYear
    2012
  • fDate
    23-25 May 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Traditional FMEA method is difficult to carry out when products haven´t enough failure information and engineers are lack of experience. A new simulation assisted FMEA method is proposed to solve this problem and the detail procedure is introduced. Stress simulation is done to give the information of local stress and help to find more possible failure modes and weakness point. In order to evaluate the effect of some complicated failure modes, failure injection technology is used to simulate each failure´s effect. Case study of FMEA of an aviation data processing device is performed. Results show that it will be helpful in finding more failures and properly evaluate their effect.
  • Keywords
    electronic products; failure (mechanical); reliability; stress analysis; FMEA method; aviation data processing device; electronic product; failure information; failure injection technology; failure modes and effect analysis; reliability analysis method; simulation assisted FMEA method; stress simulation; Analytical models; Ceramics; Heating; Integrated circuit modeling; Load modeling; Plastics; FMEA; circuit simulation; thermal analysis; vibration analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Prognostics and System Health Management (PHM), 2012 IEEE Conference on
  • Conference_Location
    Beijing
  • ISSN
    2166-563X
  • Print_ISBN
    978-1-4577-1909-7
  • Electronic_ISBN
    2166-563X
  • Type

    conf

  • DOI
    10.1109/PHM.2012.6228912
  • Filename
    6228912