Title :
Simulation assisted FMEA of electronic product
Author :
Zhang, Xiaoqin ; Chen, Ying ; Ma, Xiang ; Kang, Rui
Author_Institution :
Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
Abstract :
Traditional FMEA method is difficult to carry out when products haven´t enough failure information and engineers are lack of experience. A new simulation assisted FMEA method is proposed to solve this problem and the detail procedure is introduced. Stress simulation is done to give the information of local stress and help to find more possible failure modes and weakness point. In order to evaluate the effect of some complicated failure modes, failure injection technology is used to simulate each failure´s effect. Case study of FMEA of an aviation data processing device is performed. Results show that it will be helpful in finding more failures and properly evaluate their effect.
Keywords :
electronic products; failure (mechanical); reliability; stress analysis; FMEA method; aviation data processing device; electronic product; failure information; failure injection technology; failure modes and effect analysis; reliability analysis method; simulation assisted FMEA method; stress simulation; Analytical models; Ceramics; Heating; Integrated circuit modeling; Load modeling; Plastics; FMEA; circuit simulation; thermal analysis; vibration analysis;
Conference_Titel :
Prognostics and System Health Management (PHM), 2012 IEEE Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-1909-7
Electronic_ISBN :
2166-563X
DOI :
10.1109/PHM.2012.6228912