DocumentCode
2470811
Title
4E-6 Thermal Effect of Surface Acoustic Waves in Quartz Substrates Covered by a Metal Layer
Author
Wang, Ji ; Wu, Rongxing ; Du, Jianke ; Huang, Dejin
Author_Institution
Ningbo Univ., Ningbo
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
288
Lastpage
291
Abstract
Thermal property of surface acoustic wave (SAW) resonators is always of interests to product design and applications with the objective of accurate prediction of device performance. Theoretical and experimental studies have been carried out for the prediction of the thermal effect of piezoelectric substrates undergoing temperature change and structural complications frequently encountered in acoustic wave resonators like the presence of metal electrodes. The analysis is usually done with experimental data for the frequency-temperature relation with improved analytical models for the consideration of electrodes. In this study, we employee the incremental thermal field theory and accompanying material constants for quartz crystals, which were intended for the bulk acoustic wave (BAW) resonators analysis, to the analysis of an ideal model of SAW resonators. By taking into account the material constant dependence on temperature through the cubic relation and thermal effects on strains and equations of motion, SAW propagating in quartz crystals is formulated with the incremental thermal field theory. Our calculation of the velocity-temperature relation of quartz crystal substrates is an improvement of earlier predictions.
Keywords
quartz; surface acoustic wave resonators; surface acoustic waves; thermoacoustics; SAW resonators; SiO2; incremental thermal field theory; metal electrodes; metal layer; piezoelectric substrates; quartz substrates; structural complications; surface acoustic waves; temperature change; thermal effect; velocity-temperature relation; Acoustic waves; Analytical models; Crystalline materials; Crystals; Electrodes; Frequency; Product design; Surface acoustic wave devices; Surface acoustic waves; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1384-3
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.83
Filename
4409656
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