DocumentCode :
2471414
Title :
Acceleration sensor using SOI wafer with honeycomb insulator
Author :
Miyagawa, Yoshikazu ; Kanda, Kensuke ; Fujita, Takayuki ; Maenaka, Kazusuke ; Yokomatsu, Tokuji ; Takeuchi, Haruka ; Higuchi, Kohei
Author_Institution :
Dept. of EECS, Univ. of Hyogo, Himeji, Japan
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
2062
Lastpage :
2066
Abstract :
In this paper, fabrication method of acceleration sensor with low parasitic capacitance is descried. By using Silicon on Honeycomb Insulator (SOHI) wafer as a base material instead of Silicon on insulator (SOI) wafer, parasitic capacitance has reduced to 20%. The sensitivity of the acceleration sensor measured from differential capacitance change revealed 1.5 fF/G. The linear relationship between gravity acceleration and detection capacitance is measured by using commercial C/V converting circuit. By combining the SOHI acceleration sensor and specially designed C/V converting circuit with ultra-low power consumption, the sensitivity of the acceleration sensor can be expected to increase in 22 times than that for SOI wafer. The C/V converter circuit with ultra low power consumption of 1.13-μW will realize long term and continuous monitoring of human activities by assembled with capacitive-type sensors based on SOHI wafer.
Keywords :
acceleration measurement; accelerometers; capacitive sensors; low-power electronics; silicon-on-insulator; C/V converting circuit; SOHI acceleration sensor; SOI wafer; capacitive-type sensor; detection capacitance; fabrication method; gravity acceleration; linear relationship; parasitic capacitance; power 1.13 muW; silicon on honeycomb insulator wafer; Acceleration; Electrodes; Fabrication; Parasitic capacitance; Sensitivity; Silicon on insulator technology; Acceleration sensor; Honeycomb structure; Low parasitic capacitance; Silicon on Insulator;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems, Man, and Cybernetics (SMC), 2012 IEEE International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4673-1713-9
Electronic_ISBN :
978-1-4673-1712-2
Type :
conf
DOI :
10.1109/ICSMC.2012.6378043
Filename :
6378043
Link To Document :
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