Title :
Investigations on DC conductivity and space charge in silicone gel
Author :
Breit, F. ; Malec, D. ; Lebey, T.
Author_Institution :
ALSTOM Transp., Semeac, France
Abstract :
In power electronics, the development of new IGBT power modules allow them to switch kV and kA during μs. However, such components need to be cooled and ceramic materials are used as an interface between the electronic devices (the chips) and the cooling. Another key point of the reliability of the packaging of these devices is their encapsulation made of silicone gel to prevent any discharge on the substrate surface and also in the vicinity of the bondings. In order to identify the physical mechanisms involved in these materials, different experiments are performed. The results of conductivity and space charge measurements (using the LIPP method) under HVDC electrical stress at different temperatures are presented and analysed.
Keywords :
electrical conductivity; encapsulation; gels; power electronics; semiconductor device packaging; silicone insulation; space charge; DC conductivity; HVDC electrical stress; IGBT power modules; LIPP method; encapsulation; packaging; power electronics; silicone gel; space charge measurements; Ceramics; Conducting materials; Conductivity; Electronics cooling; Electronics packaging; Insulated gate bipolar transistors; Multichip modules; Power electronics; Space charge; Switches;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
Print_ISBN :
0-7803-7502-5
DOI :
10.1109/CEIDP.2002.1048733