6F-6 A Novel Method for Fabricating Sonic Paper

Author

Chang, Ming-Wei ; Deng, Hsu-Cheng ; Pang, Da-Chen ; Chen, Mu-Yue

Author_Institution

Ind. Technol. Res. Inst., Taipei

fYear

2007

fDate

28-31 Oct. 2007

Firstpage

527

Lastpage

530

Abstract

This paper presents the research results related to a new type of flexible capacitive micromachined ultrasonic transducers (cMUT) named "Sonic Paper". In this study, the novel design concept, relevant processing steps, and characterization experiments associated with the Sonic Paper were introduced. Compared with the existing curved or flexible CMUT, the Sonic paper features in simpler fabrication steps, lower processing temperature (less than 120degC ) and higher flexibility. Fabricated from polymer-based materials and inherited the natural flexibility from these materials, the Sonic Paper may facilitate the development and implementation of numerous innovative curvature-conforming applications in the future.

Keywords

capacitors; micromechanical devices; ultrasonic transducers; Sonic Paper fabrication; capacitive micromachined ultrasonic transducers; flexible CMUT; polymer based materials; processing temperature; Biomedical imaging; Biomembranes; Electrodes; Etching; Fabrication; Paper technology; Polymers; Silicon; Temperature; Ultrasonic transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2007. IEEE

Conference_Location

New York, NY

ISSN

1051-0117

Print_ISBN

978-1-4244-1384-3

Electronic_ISBN

1051-0117

Type

conf

DOI

10.1109/ULTSYM.2007.139

Filename

4409712