Title :
Mobitex PC card wireless modem
Author :
Moghe, S. ; Stone, J. ; Stratmoen, S. ; Consolazio, S. ; Rausch, K. ; Geske, S. ; Patel, M.
Author_Institution :
Northrop Grumman Corp., Rolling Meadows, IL, USA
Abstract :
Northrop Grumman Corporation has developed a Type II extended PC card wireless modem that operates at 900 MHz over the nationwide Mobitex wireless data network and incorporates a conventional 14.4 kbps wireline modem, as well as cellular network access capability. The modem enables notebook computer and PDA users to send and receive electronic mail and data wirelessly. Gallium Arsenide (GaAs) monolithic microwave integrated circuit (MMIC) and Silicon application specific integrated circuit (ASIC) technology made it possible to implement complex high performance functions in a small size. A second generation modem using low temperature cofired ceramic (LTCC) and Ball Grid Array (BGA) packaging technologies is under development.
Keywords :
MMIC; application specific integrated circuits; electronic mail; integrated circuit packaging; modems; transceivers; wireless LAN; 14.4 kbit/s; 900 MHz; BGA transceiver; GaAs; GaAs MMIC technology; MMIC receiver; Mobitex PC card wireless modem; Mobitex wireless data network; Northrop Grumman Corporation; PDA users; Si; Si ASIC technology; Type II extended PC card wireless modem; ball grid array packaging technology; cellular network access capability; data communication; electronic mail; low temperature cofired ceramic packaging technology; notebook computer users; personal design assistants; second generation modem; Application specific integrated circuits; Electronic mail; Electronics packaging; Gallium arsenide; Integrated circuit technology; Land mobile radio cellular systems; MMICs; Microwave integrated circuits; Modems; Personal digital assistants;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.596588
