Title :
System level signal and power integrity analysis methodology for system-in-package applications
Author :
Mandrekar, Rohan ; Bharath, Krishna ; Srinivasan, Krishna ; Engin, Ege ; Swaminathan, Madhavan
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
Abstract :
This paper describes a methodology for performing system level signal and power integrity analyses of SiP-based systems. The paper briefly outlines some new modeling and simulation techniques that have been developed to enable the proposed methodology. Some results based on the application of this methodology on test systems are also presented
Keywords :
integrated circuit modelling; system-in-package; modal decomposition; nodal admittance matrix method; power integrity; signal integrity; system-in-package; Admittance; Analytical models; Application software; Packaging; Performance analysis; Power engineering and energy; Power engineering computing; Power system modeling; Signal analysis; System testing; Causality; Design; System-In-Package (SiP); finite difference method; modal decomposition; nodal admittance matrix method; power integrity; signal integrity;
Conference_Titel :
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
1-59593-381-6
DOI :
10.1109/DAC.2006.229428
