Title :
A parallel low-rank multilevel matrix compression algorithm for parasitic extraction of electrically large structures
Author :
Yang, Chuanyi ; Chakraborty, Swagato ; Gope, Dipanjan ; Jandhyala, Vikram
Author_Institution :
Washington Univ., Seattle, WA
Abstract :
Simulation of distributed electromagnetic effects of electrically large structures is no longer a luxury but a necessity in the accurate prediction of modern day circuit performance. In this regard, integral equation based methods have steadily gained in popularity but suffer from the time and memory bottlenecks arising from the resultant dense matrix. Fast linear complexity solvers have been introduced in the past but with the growing complexity of circuit layouts parallel implementations are the only viable options in addressing practical circuit layouts. In this paper, we present a parallel implementation of the low-rank compression based fast solver with linear cost reduction capacity with respect to the number of processors. The main problems in parallelizing a hierarchical algorithm are discussed and the advantages of the implemented scheme are highlighted. The new solver enables the simulation of full-chip problems consisting of millions of unknowns with acceptable accuracy and modest time and memory requirements
Keywords :
circuit CAD; circuit complexity; integral equations; integrated circuit layout; matrix decomposition; parallel algorithms; circuit complexity; circuit layout; distributed electromagnetic effects; electrically large structures; integral equations; linear complexity solvers; linear cost reduction; parallel low-rank multilevel matrix compression algorithm; parasitic extraction; Boundary element methods; Circuit simulation; Compression algorithms; Finite difference methods; Integral equations; Maxwell equations; Modems; Permission; Predictive models; Time domain analysis; Algorithms; Compression; Design; MPI; Parallel; Parasitics; Performance;
Conference_Titel :
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
1-59593-381-6
DOI :
10.1109/DAC.2006.229433