Title :
A Study of Layer Adhesion by Acoustic Microscopy
Author :
Weglein, R.D. ; Mal, A.K.
Keywords :
Acoustic measurements; Acoustic propagation; Acoustic waves; Adhesives; Bonding; Dispersion; Microscopy; Solids; Surface acoustic waves; Welding;
Conference_Titel :
IEEE 1987 Ultrasonics Symposium
Conference_Location :
Denver, Colorado, USA
DOI :
10.1109/ULTSYM.1987.199073
