DocumentCode
2472892
Title
Generation and relaxation of free volume during the post exposure bake
Author
Stewart, Michael D. ; Burns, Sean D. ; Schmid, Gerard M. ; Willson, C. Grant
Author_Institution
Dept. of Chem. Eng., Texas Univ., Austin, TX, USA
fYear
2000
fDate
11-13 July 2000
Firstpage
94
Lastpage
95
Abstract
Upon ultraviolet exposure chemically amplified resists generate small, catalytic amounts of acid. During the post exposure bake, this acid is used to catalyze a solubility switching reaction that allows for the eventual development of latent image. The potential exists for acid catalyst to migrate from exposed regions into unexposed regions during the post exposure baking step and, thus cause feature width spread, or loss of critical dimension control. As features decrease in size, the spread caused by acid migration becomes a proportionately larger problem. This paper describes the results of experimental investigations into the fundamental mechanisms of acid transport. A fuller understanding of these mechanisms can serve both as a guide for optimizing current resist systems and for designing next generation resists.
Keywords
photoresists; ultraviolet lithography; acid transport; chemically amplified resist; critical dimension control; free volume; latent image development; post-exposure bake; solubility switching reaction; ultraviolet lithography; Chemical engineering; Design optimization; Infrared spectra; Interferometry; Monitoring; Resists; Spectroscopy; Temperature dependence; Volume relaxation;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2000 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-004-6
Type
conf
DOI
10.1109/IMNC.2000.872639
Filename
872639
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