Status of optoelectronic module packaging for avionics/aerospace applications

First generation packaging technology based on hermetic MCM-C technology is well established for LED based fiber-optic links onboard commercial jet, military jet, military helicopter, and space platforms. However, the lack of packaging commonality between the various first generation platforms has resulted in high cost optoelectronic modules. Next generation requirements will challenge packaging engineers to meet higher performance requirements, including high density array based modules, at a price and productization schedule that meets program requirements