Title :
Minimizing crosstalk in high-speed differential buses by optimizing power/ground and signal assignment
Author :
Yi, Yang ; Liu, Yifang ; Zhou, Yaping ; Becker, Wiren Dale
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas A&M Univ., College Station, TX, USA
Abstract :
Vias in packages and boards, land-grid-array pins, and connector pins introduce significant crosstalk noise in high-speed differential buses. In this paper, we propose an algorithm that minimizes crosstalk noise by optimizing power/ground distribution as well as differential signal assignment. Experimental results demonstrate its high efficiency and significant electrical benefit.
Keywords :
circuit noise; crosstalk; electronics packaging; interconnections; printed circuit design; connector pins; crosstalk minimization; crosstalk noise; differential signal assignment; high-speed differential buses; land-grid-array pins; power distribution optimization; Cells (biology); Constraint optimization; Crosstalk; Cryptography; DNA computing; Design optimization; Neural networks; Predictive models; Quantum computing; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338428
