Design of shorting vias in alternative PCB planes for suppressing ground-bounce induced electromagnetic emission

Author

Wu, Kai-Bin ; Chang, Fu-Sheng ; Wu, Ruey-Beei

Author_Institution

Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

247

Lastpage

250

Abstract

The stacked ground planes with vias stitching is employed to suppress the ground-bounce induced electromagnetic emission in multilayer printed circuit boards. This paper developed an analytic normal-mode analysis and used it to design the optimized positions of the vias in the board periphery. Comparison with full-wave simulation validates that the proposed systematic design procedure can easily achieve the desired EMI suppression from DC up to several GHz.

Keywords

electromagnetic interference; printed circuit design; PCB planes; analytic normal-mode analysis; electromagnetic emission; full-wave simulation; multilayer printed circuit board; shorting vias design; stacked ground-bounce induced EMI; systematic design procedure; vias stitching; Capacitors; Design engineering; Design optimization; Electromagnetic interference; Electromagnetic radiation; IEC standards; Magnetic separation; Nonhomogeneous media; Printed circuits; Semiconductor device noise;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338430

Filename

5338430