High density optical interconnect for board and backplane applications using polymer waveguides and VCSEL array devices

Author

Liu, Y.S. ; Rowlette, J. ; Liu, Yanbing

Author_Institution

GE Corp. Res. & Dev., Schenectady, NY

Volume

2

fYear

1998

fDate

3-4 Dec 1998

Firstpage

379

Abstract

Data link components are demonstrated based on 850 nm vertical cavity lasers (VCSELs) and short wavelength GaAs PIN detectors. These components are the foundation of an array data link solution set and offer easy incorporation with traditional multimode fiber based backplanes, or polymer waveguide based backplanes

Keywords

data communication; optical backplanes; optical fibre communication; optical interconnections; p-i-n photodiodes; photodetectors; semiconductor laser arrays; surface emitting lasers; 850 nm; GaAs; VCSEL array devices; array data link solution set; board applications; high density optical interconnect; multimode fiber based backplanes; optical backplane applications; polymer waveguide based backplanes; polymer waveguides; short wavelength GaAs PIN detectors; vertical cavity lasers; Backplanes; Optical arrays; Optical interconnections; Optical polymers; Optical receivers; Optical transmitters; Optical waveguides; Packaging; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE

Conference_Location

Orlando, FL

Print_ISBN

0-7803-4947-4

Type

conf

DOI

10.1109/LEOS.1998.739721

Filename

739721