Title :
An LCP package model for use in chip/package co-design of an X-band SiGe Low Noise Amplifier
Author :
Poh, Chung Hang John ; Thrivikraman, Tushar K. ; Bhattacharya, Swapan K. ; Patterson, Chad E. ; Cressler, John D. ; Papapolymerou, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present the modeling of a liquid crystal polymer (LCP) package for use with an X-band SiGe HBT Low Noise Amplifier (LNA). The package consists of a 2 mil LCP laminated over an embedded SiGe LNA, with vias in the LCP serving as interconnects to the LNA bondpads. An accurate model for the packaging interconnects has been developed and verified by comparing to measurement results, and can be used in chip/package co-design.
Keywords :
Ge-Si alloys; electronics packaging; integrated circuit interconnections; liquid crystal polymers; low noise amplifiers; LCP package model; LNA bondpads; SiGe; X-band low noise amplifier; chip-package co-design; liquid crystal polymer; packaging interconnects; Bonding; Circuit optimization; Circuit simulation; Coplanar waveguides; Degradation; Germanium silicon alloys; Integrated circuit interconnections; Low-noise amplifiers; Packaging; Silicon germanium;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338443
