An LCP package model for use in chip/package co-design of an X-band SiGe Low Noise Amplifier

Author

Poh, Chung Hang John ; Thrivikraman, Tushar K. ; Bhattacharya, Swapan K. ; Patterson, Chad E. ; Cressler, John D. ; Papapolymerou, John

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

203

Lastpage

206

Abstract

We present the modeling of a liquid crystal polymer (LCP) package for use with an X-band SiGe HBT Low Noise Amplifier (LNA). The package consists of a 2 mil LCP laminated over an embedded SiGe LNA, with vias in the LCP serving as interconnects to the LNA bondpads. An accurate model for the packaging interconnects has been developed and verified by comparing to measurement results, and can be used in chip/package co-design.

Keywords

Ge-Si alloys; electronics packaging; integrated circuit interconnections; liquid crystal polymers; low noise amplifiers; LCP package model; LNA bondpads; SiGe; X-band low noise amplifier; chip-package co-design; liquid crystal polymer; packaging interconnects; Bonding; Circuit optimization; Circuit simulation; Coplanar waveguides; Degradation; Germanium silicon alloys; Integrated circuit interconnections; Low-noise amplifiers; Packaging; Silicon germanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338443

Filename

5338443