Title :
Design and testing of a high speed module based memory system
Author :
Kollipara, Ravi ; Li, Ming ; Mullen, Don ; Beyene, Wendemagegnehu ; Madden, Chris ; Yuan, Chuck ; Kusamitsu, Hideki ; Ito, Toshiyasu
Author_Institution :
Rambus, Inc., Los Altos, CA, USA
Abstract :
An LCP flex based interconnect and a mating area array connector are used to increase the bandwidth of the module based memory systems. Simulations show that data rates in the range of 6.4 Gbps to 16.0 Gbps are possible depending on the memory system configuration. Tested prototype memory systems confirmed simulation predicted data rates of 16 Gbps and 12.8 Gbps for flex interconnect lengths of 6" and 12", respectively.
Keywords :
electric connectors; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; integrated circuit testing; integrated memory circuits; modules; LCP flex based interconnect; high speed module based memory system design; mating area array connector; prototype memory system testing; Assembly systems; Connectors; Crosstalk; Dielectric losses; Dielectric materials; Packaging; Random access memory; Reflection; Sockets; System testing;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338444
