• DocumentCode
    2473998
  • Title

    An ultra compact electromagnetic band gap filter for GHz power noise suppression using LTCC technology

  • Author

    Huang, Yu-Wen ; Wang, Ting-Kuang ; Wu, Tzong-Lin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2009
  • fDate
    19-21 Oct. 2009
  • Firstpage
    183
  • Lastpage
    186
  • Abstract
    A new structure to suppress simultaneous switching noise using an electromagnetic band gap filter is proposed. Based on periodic structure concept, this structure is one dimensional periodic structure with three unit cells. The size is comparable with noise suppression component such as capacitors, ferrite beads and pi filters. But unlike these components, the proposed structure would not suffer from noise problems at higher frequencies. The special characteristic is its flexible operation frequency. The band gap can be designed by using proper geometrical structure parameter. To make use of the parameter in this work, the noise beyond limitation of the pi filter could be suppressed by this structure. In this work, the size of proposed structure is 1.2 mmtimes3.8 mmtimes0.728 mm. The stop band is from 2 GHz to 5.5 GHz and is validated both by simulation and experiment. Over 25 dB noise reduction in the stop band could be achieved by this structure.
  • Keywords
    ceramic packaging; filters; noise; photonic band gap; LTCC technology; band gap; ferrite beads; frequency 2 GHz to 5.5 GHz; geometrical structure parameter; noise figure 25 dB; noise reduction; one dimensional periodic structure; pi filter; power noise suppression; simultaneous switching noise; ultracompact electromagnetic band gap filter; unit cells; Capacitors; Circuit noise; Electromagnetic interference; Frequency; Noise reduction; Nonhomogeneous media; Periodic structures; Photonic band gap; Power filters; Power transmission lines; Electromagnetic band gap (EBG); Periodic structure; Power integrity (PI); Simultaneous switching noise (SSN);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-1-4244-4447-2
  • Electronic_ISBN
    978-1-4244-5646-8
  • Type

    conf

  • DOI
    10.1109/EPEPS.2009.5338446
  • Filename
    5338446