Fast full wave analysis of PCB via arrays with model-to-hardware correlation

Author

Gu, Xiaoxiong ; Wu, Boping ; Baks, Christian ; Tsang, Leung

Author_Institution

IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

175

Lastpage

178

Abstract

This paper applies a methodology based on a mostly-analytical Foldy-Lax full wave scattering model to analyze via arrays in a multilayered printed circuit board. We have demonstrated good model-to-hardware correlation up to 20 GHz by simulating and measuring 8times8 via arrays including 29 signal vias and 35 ground vias in a 18-layer test board. The required CPU in the 64-via case is 4 seconds which is more than four orders of magnitude faster than the market leading general-purpose 3D full wave solver.

Keywords

circuit simulation; integrated circuit interconnections; printed circuits; 18-layer test board; 3D full wave solver; Foldy-Lax full wave scattering model; PCB via arrays; fast full wave analysis; ground vias; model-to-hardware correlation; multilayered printed circuit board; signal vias; time 4 s; Apertures; Dielectric substrates; Electromagnetic scattering; Electromagnetic waveguides; Electronics packaging; Equations; Integrated circuit interconnections; Magnetic separation; Mathematical model; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338448

Filename

5338448