A new EBG structure for low frequency power plane noise mitigation

Author

Scogna, A. Ciccomancini ; Romo, G.

Author_Institution

CST of America, Framingham, MA, USA

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

167

Lastpage

170

Abstract

A new electromagnetic bandgap structure for power plane noise mitigation in the low frequency range is proposed. It consists of an improved asymmetric square patch with meander lines, optimized inductance and high-K dielectric material for the substrate. An example of PWR/GND plane pairs is analyzed where fundamental stop band is demonstrated over a frequency range of less than 300 MHz to about 1 GHz.

Keywords

electronics packaging; high-k dielectric thin films; optimisation; phase noise; photonic band gap; printed circuits; EBG structure; asymmetric square patch; electromagnetic bandgap structure; high-K dielectric material; high-speed printed circuit boards; low frequency power plane noise mitigation; meander lines; optimized inductance; packages; Circuit noise; Dielectric materials; Electromagnetic interference; Frequency; High K dielectric materials; High-K gate dielectrics; Inductance; Low-frequency noise; Metamaterials; Periodic structures; Power Integrity; SSN and EBG; Signal Integrity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338450

Filename

5338450