DocumentCode :
2474168
Title :
Ultra high voltage (>12 kV), high performance 4H-SiC IGBTs
Author :
Ryu, Sei-Hyung ; Capell, Craig ; Jonas, Charlotte ; Cheng, Lin ; O´Loughlin, Michael ; Burk, Al ; Agarwal, Anant ; Palmour, John ; Hefner, Allen
Author_Institution :
Cree, Inc., Durham, NC, USA
fYear :
2012
fDate :
3-7 June 2012
Firstpage :
257
Lastpage :
260
Abstract :
We present our latest developments in ultra high voltage 4H-SiC IGBTs. A 4H-SiC P-IGBT, with a chip size of 6.7 mm × 6.7 mm and an active area of 0.16 cm2 exhibited a record high blocking voltage of 15 kV, while showing a room temperature differential specific on-resistance of 24 mΩ-cm2 with a gate bias of -20 V. A 4H-SiC N-IGBT with the same area showed a blocking voltage of 12.5 kV, and demonstrated a room temperature differential specific on-resistance of 5.3 mΩ-cm2 with a gate bias of 20 V. Buffer layer design, which includes controlling the doping concentration and the thickness of the field-stop buffer layers, was used to control the charge injection from the backside. Effects on buffer layer design on static characteristics and switching behavior are reported.
Keywords :
buffer layers; insulated gate bipolar transistors; semiconductor doping; silicon compounds; 4H-SiC P-IGBT; SiC; blocking voltage; buffer layer design; doping concentration; switching behavior; Buffer layers; Doping; Insulated gate bipolar transistors; Integrated circuits; Logic gates; Performance evaluation; Temperature measurement; IGBT; silicon carbide; ultra high voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location :
Bruges
ISSN :
1943-653X
Print_ISBN :
978-1-4577-1594-5
Electronic_ISBN :
1943-653X
Type :
conf
DOI :
10.1109/ISPSD.2012.6229072
Filename :
6229072
Link To Document :
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