• DocumentCode
    2474217
  • Title

    10E-3 GPS SAW Filter Using A Wafer Level Technique

  • Author

    Shiba, F. ; Yamazaki, M. ; Iijima, O. ; Yatsuda, H.

  • Author_Institution
    Japan Radio Co., Ltd., Fujimino
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    937
  • Lastpage
    940
  • Abstract
    A wafer-level assembled SAW filter on 36Y-X LiTaO3 with a size of 1.6x0.8 mm is presented. The SAW filter has six solder balls with a size of 0.25 mm diameters. The reason of the use of the 0.25 mm balls is that it is easy to mount the devices onto a printed circuit board using a conventional placement machine. The SAW filter is designed for a GPS RF stage application and has a center frequency of 1.5 GHz. The frequency characteristics of the SAW filter are almost the same as the ceramic packaged SAW filter. An insertion loss of 1.1 dB was obtained. Furthermore, a smaller SAW filter with 1.0x0.8 mm in size is demonstrated.
  • Keywords
    lithium compounds; microassembling; surface acoustic wave filters; wafer level packaging; GPS SAW filter; LiTaO3; insertion loss; solder ball; wafer level technique; Assembly; Ceramics; Global Positioning System; Gold; Integrated circuit packaging; Printed circuits; Radio frequency; SAW filters; Surface acoustic wave devices; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.239
  • Filename
    4409812
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2474217