Title :
Model-to-hardware correlation of disk resonators for via-array modeling in high-speed PCBs
Author :
Chada, Arun Reddy ; Kwark, Young H. ; Gu, Xiaoxiong ; Fan, Jun
Author_Institution :
Missouri S&T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Abstract :
In high-speed printed circuit board (PCB) designs, vias play a critical role in determining signal and power integrity. This paper uses disk resonators to investigate modeling approaches for common via array structures. Boundary integral equation (BIE) and effective dielectric medium approaches are used for a perforated disk resonator with non-plated holes, using dielectric properties derived from a solid disk resonator study. Both approaches are compared and validated with measurements.
Keywords :
dielectric resonators; high-speed integrated circuits; integral equations; integrated circuit modelling; printed circuits; boundary integral equation; dielectric properties; effective dielectric medium; high-speed PCB; model-to-hardware correlation; nonplated holes; perforated disk resonators; power integrity; printed circuit board; signal integrity; via-array modeling; Dielectric measurements; Electromagnetic compatibility; Frequency; Impedance; Integral equations; Laboratories; Printed circuits; Scattering parameters; Signal design; Solid modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338455
