Title :
Bonding wire current measurement with tiny film current sensors
Author :
Hirai, Hidetoshi ; Kasho, Yuya ; Tsukuda, Masanori ; Omura, Ichiro
Author_Institution :
Kyushu Inst. of Technol., Kitakyushu, Japan
Abstract :
Bonding wire current measurement technique has been highly desired to analyze failure phenomena, such as short circuit and avalanche destruction of IGBT and power diode. This paper challenged to measure bonding wire current distribution in an IGBT module with the multiple tiny film current sensors and the digital calculation technique. The authors successfully measured bonding wire current under a single shot measurement.
Keywords :
diodes; electric current measurement; failure analysis; insulated gate bipolar transistors; lead bonding; IGBT; avalanche destruction; bonding wire current measurement; failure phenomena; power diode; short circuit; tiny film current sensors; Bonding; Coils; Current measurement; Films; Magnetic sensors; Wires; bonding wire current mesurement; digital calculation technique; film current sensor with tiny-scale coils; high speed analog amplifiers;
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location :
Bruges
Print_ISBN :
978-1-4577-1594-5
Electronic_ISBN :
1943-653X
DOI :
10.1109/ISPSD.2012.6229079
