Title :
Hybrid substrate integrated waveguides developed using flexible substrates
Author :
Mahani, Mohammad S. ; Suntives, Asanee ; Abhari, Ramesh
Author_Institution :
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, QC, Canada
Abstract :
In this paper, hybrid substrate integrated waveguide (SIW) structures developed using multi-layer flexible laminates are investigated for application in off-the-board chip-to-chip communication systems. It is shown through full-wave simulations that the transmission characteristics of the TEM and TE10 channels of the hybrid SIW are virtually unaffected by the substrate bending. This new implementation platform is found to be suitable for high-speed applications due to its relatively low dielectric losses and offers new possibilities for deployment of the hybrid SIW interconnect.
Keywords :
dielectric losses; integrated circuit interconnections; laminates; multilayers; printed circuits; substrate integrated waveguides; TE10 channels; dielectric losses; flexible substrates; full wave simulation; high-speed applications; hybrid SIW interconnect; hybrid substrate integrated waveguides; multilayer flexible laminates; off-the-board chip-to-chip communication systems; substrate bending; Application software; Dielectric losses; Dielectric substrates; Electromagnetic waveguides; Fabrication; High-speed electronics; Integrated circuit interconnections; Laminates; Routing; Stripline;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338460
