• DocumentCode
    2474402
  • Title

    Dielectric breakdown of polyethylene-carbon black composites

  • Author

    Tomimura, T. ; Nakamura, S. ; Ohshita, A. ; Okamoto, T.

  • Author_Institution
    Dept. of Electron., Mie Univ., Tsu, Japan
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    526
  • Lastpage
    529
  • Abstract
    During the last three decades extensive and worldwide research progress was made with respect to many aspects of percolation phenomena with the advance of computer technology. The physical properties of composites are well expressed as a function of a power law of the distance from the percolation threshold to a volume fraction of a filler with each critical exponent. Electrical properties at high electric fields of composites have not yet been investigated based on the percolation theory in depth. Works on numerical modeling of dielectric breakdown have been done for a random resistor-capacitor network. The aim of this paper is to discuss the dielectric breakdown of carbon black-polyethylene composites based on the percolation phenomena of the composites. The more the dielectric breakdown strength decreases as the more carbon black is loaded. It has been found for the first time that the dielectric breakdown strength of the composites is described by a function of a power law of the distance from the volume fraction of carbon black to the percolation threshold with the critical exponent of ν = 0.9.
  • Keywords
    electric breakdown; filled polymers; percolation; critical exponent; dielectric breakdown; electrical properties; percolation model; polyethylene-carbon black composite; power law; random resistor-capacitor network; Absorption; Composite materials; Conducting materials; Conductivity; Dielectric breakdown; Dielectric measurements; Organic materials; Petroleum; Polyethylene; Resins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
  • Print_ISBN
    0-7803-7502-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2002.1048849
  • Filename
    1048849