• DocumentCode
    2474405
  • Title

    A multi-region trap characterization method and its reliability application on STI-based high-voltage LDMOSFETs

  • Author

    He, Yandong ; Zhang, Ganggang ; Zhang, Xing

  • Author_Institution
    Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
  • fYear
    2012
  • fDate
    3-7 June 2012
  • Firstpage
    307
  • Lastpage
    310
  • Abstract
    The STI-based laterally diffused metal-oxide-semiconductor (LDMOS) devices have become popular with its better tradeoff between breakdown voltage and on-resistance and its compatibility with the standard complementary metal-oxide-semiconductor (CMOS) process. In this paper, a multi-region trap characterization direct current current-voltage (MR-DCIV) technique was proposed to characterize interface state generation in both channel and STI drift regions. The correlation between interface trap and MR-DCIV current has been verified by two-dimensional device simulation. Degradation of STI-based LDMOS transistors in various reliability stress modes is investigated experimentally by proposed technique. The impact of interface state location on device electrical characteristics is analyzed from measurement and simulation. Our study reveals that OFF-state stress becomes the worst degradation mode in term of the on-resistance degradation, which is attributed to interface state generation under STI drift region.
  • Keywords
    CMOS integrated circuits; MOSFET; electric breakdown; electron traps; interface states; semiconductor device reliability; LDMOS devices; MR-DCIV technique; OFF-state stress; STI drift regions; STI-based LDMOS transistor degradation; STI-based high-voltage LDMOSFET reliability; breakdown voltage; device electrical characteristics; direct current current-voltage technique; interface state generation; interface trap; laterally diffused metal-oxide-semiconductor devices; multiregion trap characterization method; on-resistance degradation; standard complementary metal-oxide-semiconductor process; two-dimensional device simulation; Degradation; Interface states; Logic gates; Stress; Substrates; Voltage measurement; High voltage LDMOS; degradation; interface state; multi-region direct current IV technique;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
  • Conference_Location
    Bruges
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4577-1594-5
  • Electronic_ISBN
    1943-653X
  • Type

    conf

  • DOI
    10.1109/ISPSD.2012.6229084
  • Filename
    6229084