Title :
Extraction of equivalent inductance in package-PCB hierarchical power distribution network
Author :
Kim, Jingook ; Kim, Jaemin ; Ren, Liehui ; Fan, Jun ; Kim, Joungho ; Drewniak, James L.
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol. (formerly Univ. of Missouri-Rolla), Rolla, MO, USA
Abstract :
A method to calculate equivalent inductances of multiple vias in arrays has been proposed. The method has been applied to the modeling of a hierarchical power bus and validated by measurements. It is accurate at the frequencies lower than the cavity resonant frequencies.
Keywords :
inductance; printed circuits; cavity resonant frequencies; equivalent inductances; multiple vias; package-PCB hierarchical power distribution network; Capacitors; Cavity resonators; Impedance; Inductance; Packaging; Power system modeling; Power systems; Resonance; Resonant frequency; Transmission line matrix methods;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338464
