Title :
Status and trend of automotive power packaging
Author_Institution :
Oak Ridge Nat. Lab., Knoxville, TN, USA
Abstract :
Comprehensive requirements in aspects of cost, reliability, efficiency, form factor, weight, and volume for power electronics modules in modern electric drive vehicles have driven the development of automotive power packaging technology intensively. Innovation in materials, interconnections, and processing techniques is leading to enormous improvements in power modules. In this paper, the technical development of and trends in power module packaging are evaluated by examining technical details with examples of industrial products. The issues and development directions for future automotive power module packaging are also discussed.
Keywords :
automotive electronics; electric drives; hybrid electric vehicles; interconnections; modules; power electronics; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; automotive power module packaging; electric drive vehicles; form factor; hybrid electric vehicles; industrial products; interconnections; power electronics modules reliability; processing techniques; Automotive engineering; Cooling; Electrodes; Multichip modules; Substrates; Wires; electric drive; hybrid electric & electric vehicles; packaging; power module; power semiconductor;
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location :
Bruges
Print_ISBN :
978-1-4577-1594-5
Electronic_ISBN :
1943-653X
DOI :
10.1109/ISPSD.2012.6229088