Title :
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
Author :
Xie, Jianyong ; Chung, Daehyun ; Swaminathan, Madhavan ; Mcallister, Michael ; Deutsch, Alina ; Jiang, Lijun ; Rubin, Barry J.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system.
Keywords :
circuit simulation; thermal conductivity; thermal management (packaging); voltage distribution; 3D system integration; electrical characteristics; hot spot temperature; parameterized electrical-thermal co-analysis; power delivery networks; system components; thermal characteristics; thermal interface material; through-silicon vias; underfill material; voltage source location affect; Conducting materials; Control systems; Electric variables control; Position measurement; Stacking; Temperature; Thermal conductivity; Thermal variables control; Through-silicon vias; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338465
